The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena announced its scalable LightBundle chiplet interconnect solution, offering ultra-high density die-to-die connections with a multi-Tbps/mm shoreline bandwidth density at sub-pJ/bit energy efficiency. In this podcast we talk to Bardia Pezeshki, Founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.

The increasing demand for high-performance computing for next-generation AI and advanced data centers is putting pressure on designers to field the latest data-management solutions. Addressing this demand, Rambus recently unveiled an updated PCI Express 7.0 IP portfolio, encompassing a comprehensive suite of IP solutions, as well as a controller IP for GDDR7 to allow for greater speeds and bandwidths to support generative AI workloads.

These applications consume memory at an unprecedented pace, and the new controller IP will unlock more memory for AI and high-performance computing applications, particularly in inferencing and at the network’s edge. In this podcast we talk with Lou Ternullo, Senior Director of IP Solutions at Rambus, about how the GenAI boom is pushing new advancements in innovations in the memory space.

Addressing the need for low-power high-reliability connectivity in IoT solutions, Wi-Fi HaLow promises extended ranges, improved penetration capabilities, extended battery life, enhanced device density, higher level of security, and elevated data throughput in IoT scenarios. The Wireless Broadband Alliance (WBA) recently announced the Wi-Fi HaLow for IoT program has moved into a new phase, testing 802.11ah Wi-Fi HaLow solutions in real-world use cases, including a range of applications including smart home, smart city, building automation, smart retail, industrial IoT, and agriculture technology.

Tiago Rodrigues, CEO of the Wireless Broadband Alliance, talks about the trails and the overall IoT marketplace.

Artificial Intelligence (AI) is evolving from a hot topic and buzzword to a real set of commercial solutions for business, industrial, medical, military, and consumer applications. The challenge in developing AI and Machine Learning (ML) solutions range from determining what kind of AI methodology should be implemented to the training and deploying AI- and ML-based solutions. Sam Fok, CEO of Femtosense, a company working on using Sparse AI for the real-time Edge applications, talks about the future of this technology.

Creating products today is a challenging task, and not only because of the demands of the application. The sheer number of interrelated subsystems and the variety of core technologies involved make creating a product a task of integration and functionality convergence. In this podcast, we talk to John Leavitt, a Human Centered Designer and Product Developer at Intelligent Product Solutions, a product design and engineering services company that provides concepts for industrial design, mechanical engineering, embedded software, and systems architecture for companies developing products.

The expansion of AI in the latest application spaces is creating problems at the board and chip level, as over 90% of the power consumption in AI workloads is from the movement of data. The ability to shorten data paths by moving the compute element closer to where the data is stored can reduce power consumption significantly.

This would also enable an unprecedented increase in compute density. In this podcast we talk to Robert Beachler, Vice President of Product at Untether AI, a company launched with the goal of addressing the major compute and efficiency bottleneck, memory access and data management.

Industrial e-mobility applications require reliable and efficient solutions to manage high voltages and currents, and wide-bandgap semiconductors like Wolfspeed silicon carbide devices enable higher switching frequencies and greater power densities at much higher operating temperatures. In this episode, we talk to Guy Moxey, the VP of Power Development at Wolfspeed, about where we are and where he thinks the wide-bandgap industry is going.

We are currently in the middle of a disruptive evolution in power electronics, driven by the growing availability of wide-bandgap semiconductors like Gallium Nitride (GaN) and Silicon Carbide (SiC). These new devices are challenging legacy circuit designs, by forcing them to migrate upwards in capability to deliver the performance advantages available. In today’s podcast we talk to Denis Marcon, General Manager of Innoscience Europe, about the challenges and opportunities being provided to the power electronics industry by wide-bandgap semiconductors.